Manufacturing overview
HDI fabrication supports high-density interconnections using fine circuit features and defined via structures. The buildup sequence and layer spans are essential manufacturing inputs.
Define every via structure
Include a via map identifying the connected layers. Describe stacked or staggered structures, via-in-pad locations and any filling or capping requirements. These details affect the manufacturing route.
Review fine features in context
Line width and spacing depend on copper and construction. Submit the stackup and the actual geometry rather than selecting isolated minimum values from a capability table.
HDI layers and buildup are different specifications
HDI describes high-density interconnection features, including microvias and buildup structures. Total conductive layer count, buildup order and lamination cycles are different concepts. PCBELEC supports review of 1+N+1 through 3+N+3 structures, with more advanced constructions subject to review. Send the actual stackup and via map instead of relying on a shorthand label alone.
| HDI input | Information for review |
|---|---|
| Buildup structure | Show the sequential construction and each via span. |
| Microvias | Identify stacked or staggered arrangement and relevant geometry. |
| Via treatment | Define filling, capping and pad requirements where needed. |
| Materials and copper | Specify dielectric system, layer thicknesses and copper. |
What to include in your quotation request
Provide the fabrication package and drawing at one revision. Distinguish fixed requirements from items open to engineering proposals. Include quantity and the required ship or arrival date; the material, construction and verification scope must be reviewed before the delivery plan is confirmed.
- Fabrication artwork, drill data and mechanical outline.
- Stackup, material grades and finished copper requirements.
- Surface finish, critical tolerances and special features.
- Required inspection, test conditions and documentation.
- Quantity, project stage, destination and date requirement.
What drives HDI manufacturing complexity?
Sequential construction, microvia arrangement, filling and capping requirements, material selection and fine-feature geometry all affect the manufacturing route. More complex interconnections can add process steps and verification needs. Review these features against the routing objective before choosing a more advanced structure.
Questions, answered
Before your next build
What should I include in the quotation package?
Send fabrication and drill data, a drawing, stackup or construction details, quantity, material and finish requirements, and the required ship or arrival date.
Are stacked and staggered microvias the same?
No. They describe different arrangements of microvias through the buildup layers. Identify the arrangement and layer spans in the via map so the construction can be reviewed.
Does an HDI layer count define the process?
No. Total conductive layers do not fully describe buildup order or interconnection. Supply the complete stackup and via map.