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PCB materials and stackup requirements
GUIDE / PCBELEC
# PCB materials and stackup requirements
Explore FR-4, high-Tg, polyimide, high-frequency and metal-based PCB material categories and prepare a clear material specification.
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## Choose by electrical and mechanical needs
Material planning should reflect electrical performance, operating conditions, thermal needs and the board structure. A named material grade and a broad material category are different specifications.
## Material families
The original PCBELEC material library covers FR-4, high-Tg, polyimide, RF and high-frequency, aluminum, copper-core, ceramic and specialty material topics. Suitability and availability must be confirmed for the construction.
## Control alternatives
Specify a mandatory grade, an approved list or performance-based requirements. If alternatives are allowed, identify what needs approval. Include the layer stackup and relevant electrical, thermal and mechanical targets.
## Choose materials by the requirement they serve
The material system is part of the board construction. Compare electrical, thermal and mechanical needs together instead of treating materials as interchangeable names.
| Material family | Common selection focus | Define for quotation |
| --- | --- | --- |
| FR-4 | Rigid and multilayer construction | Grade, dielectric thickness and copper. |
| High-Tg FR-4 | Thermal process and environmental demands | Grade and complete thermal requirements. |
| Polyimide | Flexible and rigid-flex circuits | Film, copper, bonding, coverlay and bend conditions. |
| RF laminates | Dielectric behavior and signal loss | Exact grade, construction and relevant data. |
| Metal-base systems | Thermal and mechanical integration | Base metal and insulating dielectric separately. |
## Control material substitutions
If the design requires a named laminate, state that requirement. If alternatives can be proposed, define the approval criteria. A proposed equivalent should be reviewed against the relevant construction and properties, not accepted solely because it belongs to the same broad material family.
CONTINUE YOUR REVIEW
## Related manufacturing resources
guide
### [FR-4 PCB Materials ↗](https://www.chinasuqi.com/en/materials/fr4/)
Compare FR-4 laminate requirements for rigid and multilayer PCBs: grade, Tg, dielectric construction, copper and approved substitutions.
guide
### [High-Tg PCB Materials ↗](https://www.chinasuqi.com/en/materials/high-tg/)
Understand high-Tg FR-4 selection for thermally demanding PCBs, including assembly exposure, laminate properties and stackup requirements.
guide
### [Polyimide Materials for Flex & Rigid-Flex PCBs ↗](https://www.chinasuqi.com/en/materials/polyimide/)
Specify polyimide flex circuits as a complete material system: copper, adhesive, coverlay, stiffeners and the intended bend conditions.
guide
### [Rogers PCB Materials & RF Stackups ↗](https://www.chinasuqi.com/en/materials/rogers/)
Define Rogers laminate grade, dielectric thickness, copper and bonding requirements for RF, microwave and hybrid PCB stackups.
technology
### [Metal-core PCB fabrication ↗](https://www.chinasuqi.com/en/pcb-technologies/metal-core/)
Metal-core PCB construction combines circuit layers with a metal base and an insulating system. Define the thermal, electrical and mechanical requirements together.
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## Let’s define your next build.
Start with your files, requirements and target date.
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